Cartridge transfer module and bare chip bonding device using same

The present invention relates to a cassette transfer module and a die bonding apparatus using the same, the cassette transfer module comprising: an OHT port into which a cassette is inserted from an OHT; the conveyor is used for conveying the material box to a transfer position; an inter-unit transfer member that transfers the cassette between the OHT port and the conveyor; and a double-shaft drive unit for transferring the magazine disposed at the transfer position to the next process, the conveyor comprising: a rail including a pair of rail members provided so as to be long in the Y-axis direction and support the magazine, the rail members being spaced apart from each other by a certain distance; a first transfer member including: a plate-shaped support plate disposed between the pair of rail members; a Z-axis driving unit that moves the support plate in the Z-axis direction; and a Y-axis driving unit that moves the support plate in the Y-axis direction, moves the cartridge upward in a state in which the su