Computer CPU radiator
The invention relates to the technical field of heat dissipation, in particular to a computer CPU radiator which comprises a heat conduction cylinder and a limiting frame, an installation supporting frame is fixedly arranged on the lower surface of the limiting frame and fixed to a mainboard in a co...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of heat dissipation, in particular to a computer CPU radiator which comprises a heat conduction cylinder and a limiting frame, an installation supporting frame is fixedly arranged on the lower surface of the limiting frame and fixed to a mainboard in a computer case, and a CPU on the mainboard is located in the middle of the limiting frame. A heat dissipation base is fixedly arranged at the bottom end of the heat conduction cylinder, heat insulation rods which are annularly distributed at equal intervals are fixedly arranged at the top end of the heat conduction cylinder, a fan assembly is fixedly arranged at the top ends of the heat insulation rods, heat dissipation fins which are annularly distributed at equal intervals are further arranged on the outer wall of the heat conduction cylinder, and a fence is fixedly arranged on the lower surface of the fan assembly. And the fences are positioned on the outer sides of the radiating fins. The heat energy absorbed by d |
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