Chip and mask laminating method and device, electronic equipment and storage medium

The embodiment of the invention provides a chip and mask laminating method and device, electronic equipment and a storage medium, and belongs to the field of chip processing. The method comprises the following steps: acquiring an initial motion parameter; wherein the initial motion parameters comprise an initial coordinate position and preset fitting time; driving the target chip to rise from the initial coordinate position to the mask plate at a preset rising speed through the servo driver; according to a pressure feedback value output by the pressure sensor and a preset pressure maintaining mode, the target chip and the mask plate are controlled to be attached; wherein the pressure maintaining mode represents that the target chip and the mask plate are laminated at a preset pressure threshold and a preset lamination time at a constant pressure. According to the embodiment of the invention, the stability of fitting pressure can be improved. 本申请实施例提供了一种芯片与掩膜的贴合方法和装置、电子设备及存储介质，属于芯片加工领域。该方法包括：获取初始运动参数；其中，所述初始运动