Curable resin composition and electronic component device

The curable resin composition contains an epoxy resin and a phenolic hardener at an equivalence ratio of a phenolic hydroxyl group of the phenolic hardener to an epoxy group of the epoxy resin of 0.5 or more and less than 1.0. 一种硬化性树脂组合物，其中，以酚系硬化剂的酚性羟基相对于环氧树脂的环氧基的当量比0.5以上且未满1.0含有环氧树脂及酚系硬化剂。...

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Bibliographische Detailangaben
Hauptverfasser:	HATAKEYAMA KEIICHI, YAMAMOTO TAKAYA, YOKOKURA AI, NISHIYAMA TOMOO, KANG DONGCHUL, KIM KWI-HWA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The curable resin composition contains an epoxy resin and a phenolic hardener at an equivalence ratio of a phenolic hydroxyl group of the phenolic hardener to an epoxy group of the epoxy resin of 0.5 or more and less than 1.0. 一种硬化性树脂组合物，其中，以酚系硬化剂的酚性羟基相对于环氧树脂的环氧基的当量比0.5以上且未满1.0含有环氧树脂及酚系硬化剂。