Dynamic and static compatible intrinsic digital pressure sensor and manufacturing method thereof
The invention discloses a dynamic and static compatible intrinsic digital pressure sensor and a manufacturing method thereof, the dynamic and static compatible intrinsic digital pressure sensor comprises a sensitive chip, a glass lining and an armored cylindrical tube socket, the front surface of th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a dynamic and static compatible intrinsic digital pressure sensor and a manufacturing method thereof, the dynamic and static compatible intrinsic digital pressure sensor comprises a sensitive chip, a glass lining and an armored cylindrical tube socket, the front surface of the sensitive chip is provided with a reverse sealing peripheral causeway and a diffusion silicon bonding pad which are in electrostatic bonding with the glass lining; according to the dynamic/static compatible intrinsic digital pressure sensor, a conventional packaging method different from a silicon pressure sensitive chip is adopted, the use of liquid or colloid and metal cylinder materials and the existence of a movable structure are eliminated, and the additional applicability and reliability defects of the conventional packaging of the silicon pressure sensor are fundamentally eliminated and improved; the silicon resonance pressure sensor continues the innate advantages of high inherent frequency and ideal elas |
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