Dynamic and static compatible intrinsic digital pressure sensor and manufacturing method thereof

The invention discloses a dynamic and static compatible intrinsic digital pressure sensor and a manufacturing method thereof, the dynamic and static compatible intrinsic digital pressure sensor comprises a sensitive chip, a glass lining and an armored cylindrical tube socket, the front surface of th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: REN JIANKUN, HAN BINGBING, CHEN XINQI, BAI YANG, CHENG ZUJIE
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a dynamic and static compatible intrinsic digital pressure sensor and a manufacturing method thereof, the dynamic and static compatible intrinsic digital pressure sensor comprises a sensitive chip, a glass lining and an armored cylindrical tube socket, the front surface of the sensitive chip is provided with a reverse sealing peripheral causeway and a diffusion silicon bonding pad which are in electrostatic bonding with the glass lining; according to the dynamic/static compatible intrinsic digital pressure sensor, a conventional packaging method different from a silicon pressure sensitive chip is adopted, the use of liquid or colloid and metal cylinder materials and the existence of a movable structure are eliminated, and the additional applicability and reliability defects of the conventional packaging of the silicon pressure sensor are fundamentally eliminated and improved; the silicon resonance pressure sensor continues the innate advantages of high inherent frequency and ideal elas