Board-to-board connector with copper foil structure and preparation process thereof

The invention discloses a board-to-board connector with a copper foil structure and a preparation process of the board-to-board connector. The board-to-board connector comprises welding flux, a copper link, a copper foil, a tooth-shaped locking structure, a male connector substrate and a female conn...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG SHAOLI, TIAN WENCHAO, ZHANG WENYAN, LIANG SHIQIAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a board-to-board connector with a copper foil structure and a preparation process of the board-to-board connector. The board-to-board connector comprises welding flux, a copper link, a copper foil, a tooth-shaped locking structure, a male connector substrate and a female connector substrate. According to the invention, horizontal plugging between the circuit boards is realized through link bending, and the space required for installation is reduced. The copper foil is added in the high-impedance area of the connector to match impedance. According to the invention, a tooth-shaped locking structure is adopted at the plugging position of the male connector and the female connector, and guiding and locking are carried out at a designed position during plugging. The copper link is manufactured by adopting an etching process, and compared with a stamping process, defects such as burrs can be reduced, the process precision is improved, and the conductor loss is reduced. The device is small in