Wafer boat and semiconductor process equipment
The invention discloses a wafer boat and semiconductor process equipment, the disclosed wafer boat comprises a support and a wafer bearing device, the wafer bearing device comprises an edge bearing part and an extension bearing part, the edge bearing part encloses to form an avoidance space with an...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a wafer boat and semiconductor process equipment, the disclosed wafer boat comprises a support and a wafer bearing device, the wafer bearing device comprises an edge bearing part and an extension bearing part, the edge bearing part encloses to form an avoidance space with an opening, the extension bearing part is connected with the edge bearing part, and the edge bearing part is connected with the extension bearing part. The extension bearing part is arranged on the support and extends towards the avoiding space, the edge bearing part and the extension bearing part are used for jointly supporting a wafer, the edge bearing part is used for supporting the edge of the wafer, and the wafer bearing device is connected with the support. According to the scheme, the problem that the warping degree of the wafer is large when the wafer boat carries the wafer for the process in the prior art can be solved.
本发明公开一种晶舟和半导体工艺设备,所公开的晶舟包括支架和晶圆承载装置,其中:所述晶圆承载装置包括边缘承载部和延伸承载部,所述边缘承载部围成具有开口的避让空间,所述延伸承载部与所述 |
---|