SUBSTRATE PROCESSING APPARATUS AND CONTROL METHOD FOR SUBSTRATE PROCESSING APPARATUS

A substrate processing apparatus includes a plurality of processing units, an exhaust path, a gas processing device, and a controller. Gas discharged from a plurality of processing units that process a substrate by using a chemical product flows through the exhaust path. The gas processing apparatus...

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Hauptverfasser: TSUGAO, KEISUKE, TAKIMOTO YUJI
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TAKIMOTO YUJI
description A substrate processing apparatus includes a plurality of processing units, an exhaust path, a gas processing device, and a controller. Gas discharged from a plurality of processing units that process a substrate by using a chemical product flows through the exhaust path. The gas processing apparatus removes a target component in a gas, and includes a duct, a partition plate, a liquid supply unit, and a concentration detection unit. The conduit has a flow path. The partition plates partition the flow path into a plurality of spaces and are formed of a porous material. The liquid supply unit supplies the dissolving liquid to the partition plate. The concentration detection means detects the concentration of the target component. The controller adjusts a flow rate of the dissolving liquid based on at least one of operation information indicating an operation state of the plurality of processing units and a detection result of the concentration detection unit. 本发明提供一种基板处理设备,其包括多个处理单元、排气路径、气体处理装置和控制器。从通过使用化学产品来处理基
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subjects BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
title SUBSTRATE PROCESSING APPARATUS AND CONTROL METHOD FOR SUBSTRATE PROCESSING APPARATUS
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