Substrate processing apparatus

The technical range of the present disclosure provides a substrate processing apparatus including: a first supply unit and a second supply unit each configured to eject a fluid onto a substrate placed on a substrate support unit, wherein the first supply unit includes a first support connected to a first support shaft configured to rotate such that the first support rotates integrally with the first support shaft; a connecting member connected to the first support and bent at a first angle in a direction parallel to an upper surface of the substrate; and a first nozzle connected to the connecting member and bent toward the substrate at a predetermined angle, and the first support is configured to rotate a second angle in a direction parallel to an upper surface of the substrate. 本公开的技术范围提供了一种基板处理设备，所述基板处理设备包括：第一供应单元和第二供应单元，所述第一供应单元和第二供应单元各自被配置为将流体喷射到放置在基板支撑单元上的基板上，其中所述第一供应单元包括第一支撑件，所述第一支撑件连接到被配置为旋转的第一支撑轴，使得所述第一支撑件与所述第一支撑轴一体地旋转；连接构件，所述连接构件连接到所述第一支撑件并在平行于所述基板的上表面的方向上弯曲第一角度；以及第一喷嘴，所述第一喷嘴连接到所述连接构件并以预定角度朝向所述基板弯曲，并