Three-dimensional grid model through hole identification method and device and electronic equipment
The invention discloses a three-dimensional grid model through hole identification method and device and electronic equipment. The method comprises the following steps: acquiring a three-dimensional grid model; determining a plurality of sharp edges in the three-dimensional model; determining a plur...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a three-dimensional grid model through hole identification method and device and electronic equipment. The method comprises the following steps: acquiring a three-dimensional grid model; determining a plurality of sharp edges in the three-dimensional model; determining a plurality of circular rings based on the plurality of sharp edges; the multiple circular rings are assembled, and the pipeline is obtained; based on the pipeline, a through hole is determined, and the through hole is used for indicating the through pipeline. The technical problem of low accuracy of a through hole identification result of a three-dimensional grid model through hole identification method in the related technology is solved.
本发明公开了一种三维网格模型通孔识别方法、装置及电子设备。其中,该方法包括:获取三维网格模型;确定三维模型中的多条尖边;基于多条尖边,确定多个圆环;对多个圆环进行组装处理,得到管道;基于管道,确定通孔,其中,通孔用于指示贯通的管道。本发明解决了相关技术中的三维网格模型通孔识别方法存在通孔识别结果准确性低的技术问题。 |
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