Conductive pvd stack-up design for improved reliability of deposited electrodes
The invention relates to a conductive PVD stack-up design for improving the reliability of deposited electrodes. An electronic device may include a housing component that may define an inner surface and an outer surface of the device; a first film deposited on the inner surface and extending at leas...
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| creator | KIM JONGHAE VARADARAJAN SRIKANTH DAS, ARNAB LIANG JUN OETTING WOLFGANG MELCHER MARTIN |
| description | The invention relates to a conductive PVD stack-up design for improving the reliability of deposited electrodes. An electronic device may include a housing component that may define an inner surface and an outer surface of the device; a first film deposited on the inner surface and extending at least partially around an edge of the housing component onto the outer surface; and a second film deposited on the outer surface and at least partially deposited on a portion of the first film on the outer surface, the second film in electrical communication with a portion of the first film deposited on the inner surface.
本公开涉及用于改善沉积电极的可靠性的导电PVD层叠设计。一种电子设备，所述电子设备可包括：外壳部件，所述外壳部件可限定所述设备的内表面和外表面；第一膜，所述第一膜沉积于所述内表面上并至少部分地围绕所述外壳部件的边缘延伸到所述外表面上；以及第二膜，所述第二膜沉积于所述外表面上并且至少部分地沉积于所述外表面上的所述第一膜的一部分上，所述第二膜与沉积于所述内表面上的所述第一膜的一部分电连通。 |
| format | Patent |
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本公开涉及用于改善沉积电极的可靠性的导电PVD层叠设计。一种电子设备，所述电子设备可包括：外壳部件，所述外壳部件可限定所述设备的内表面和外表面；第一膜，所述第一膜沉积于所述内表面上并至少部分地围绕所述外壳部件的边缘延伸到所述外表面上；以及第二膜，所述第二膜沉积于所述外表面上并且至少部分地沉积于所述外表面上的所述第一膜的一部分上，所述第二膜与沉积于所述内表面上的所述第一膜的一部分电连通。</description><language>chi ; eng</language><subject>CALCULATING ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; COMPUTING ; COUNTING ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DIGITAL DATA PROCESSING ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PHYSICS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240409&DB=EPODOC&CC=CN&NR=117850547A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240409&DB=EPODOC&CC=CN&NR=117850547A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM JONGHAE</creatorcontrib><creatorcontrib>VARADARAJAN SRIKANTH</creatorcontrib><creatorcontrib>DAS, ARNAB</creatorcontrib><creatorcontrib>LIANG JUN</creatorcontrib><creatorcontrib>OETTING WOLFGANG</creatorcontrib><creatorcontrib>MELCHER MARTIN</creatorcontrib><title>Conductive pvd stack-up design for improved reliability of deposited electrodes</title><description>The invention relates to a conductive PVD stack-up design for improving the reliability of deposited electrodes. An electronic device may include a housing component that may define an inner surface and an outer surface of the device; a first film deposited on the inner surface and extending at least partially around an edge of the housing component onto the outer surface; and a second film deposited on the outer surface and at least partially deposited on a portion of the first film on the outer surface, the second film in electrical communication with a portion of the first film deposited on the inner surface.
本公开涉及用于改善沉积电极的可靠性的导电PVD层叠设计。一种电子设备，所述电子设备可包括：外壳部件，所述外壳部件可限定所述设备的内表面和外表面；第一膜，所述第一膜沉积于所述内表面上并至少部分地围绕所述外壳部件的边缘延伸到所述外表面上；以及第二膜，所述第二膜沉积于所述外表面上并且至少部分地沉积于所述外表面上的所述第一膜的一部分上，所述第二膜与沉积于所述内表面上的所述第一膜的一部分电连通。</description><subject>CALCULATING</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PHYSICS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB3zs9LKU0uySxLVSgoS1EoLklMztYtLVBISS3OTM9TSMsvUsjMLSjKL0tNUShKzclMTMrMySypVMhPAyopyC_OLAFKpOakJpcU5QP18DCwpiXmFKfyQmluBkU31xBnD12g2vjU4oLE5NS81JJ4Zz9DQ3MLUwNTE3NHY2LUAACHmDdp</recordid><startdate>20240409</startdate><enddate>20240409</enddate><creator>KIM JONGHAE</creator><creator>VARADARAJAN SRIKANTH</creator><creator>DAS, ARNAB</creator><creator>LIANG JUN</creator><creator>OETTING WOLFGANG</creator><creator>MELCHER MARTIN</creator><scope>EVB</scope></search><sort><creationdate>20240409</creationdate><title>Conductive pvd stack-up design for improved reliability of deposited electrodes</title><author>KIM JONGHAE ; VARADARAJAN SRIKANTH ; DAS, ARNAB ; LIANG JUN ; OETTING WOLFGANG ; MELCHER MARTIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117850547A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PHYSICS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM JONGHAE</creatorcontrib><creatorcontrib>VARADARAJAN SRIKANTH</creatorcontrib><creatorcontrib>DAS, ARNAB</creatorcontrib><creatorcontrib>LIANG JUN</creatorcontrib><creatorcontrib>OETTING WOLFGANG</creatorcontrib><creatorcontrib>MELCHER MARTIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM JONGHAE</au><au>VARADARAJAN SRIKANTH</au><au>DAS, ARNAB</au><au>LIANG JUN</au><au>OETTING WOLFGANG</au><au>MELCHER MARTIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Conductive pvd stack-up design for improved reliability of deposited electrodes</title><date>2024-04-09</date><risdate>2024</risdate><abstract>The invention relates to a conductive PVD stack-up design for improving the reliability of deposited electrodes. An electronic device may include a housing component that may define an inner surface and an outer surface of the device; a first film deposited on the inner surface and extending at least partially around an edge of the housing component onto the outer surface; and a second film deposited on the outer surface and at least partially deposited on a portion of the first film on the outer surface, the second film in electrical communication with a portion of the first film deposited on the inner surface.
本公开涉及用于改善沉积电极的可靠性的导电PVD层叠设计。一种电子设备，所述电子设备可包括：外壳部件，所述外壳部件可限定所述设备的内表面和外表面；第一膜，所述第一膜沉积于所述内表面上并至少部分地围绕所述外壳部件的边缘延伸到所述外表面上；以及第二膜，所述第二膜沉积于所述外表面上并且至少部分地沉积于所述外表面上的所述第一膜的一部分上，所述第二膜与沉积于所述内表面上的所述第一膜的一部分电连通。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPUTING COUNTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DIGITAL DATA PROCESSING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Conductive pvd stack-up design for improved reliability of deposited electrodes |
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