Method for evaluating reliability of high-density flip-chip device

The invention discloses a reliability evaluation method for a high-density flip-chip bonding device, and the method comprises the steps: analyzing the reliability problems caused by the defects of a bump preparation process, a chip flip-chip bonding process and an underfill process, and building an index system for carrying out the reliability evaluation of the flip-chip bonding device according to the reliability problems caused by different process defects. The index system comprises bump coplanarity, bump voidage, bump strength, flip-chip solder joint void and offset, flip-chip solder joint strength and bottom filling voidage; determining a corresponding detection method, a test condition and a criterion according to the characteristic of each index, wherein the detection method comprises salient point coplanarity detection, X-ray detection, salient point shear force test, flip chip pull-off detection, bonding strength detection and ultrasonic detection; therefore, a detection test is designed, and the rel