Surface treatment method of copper foil with low roughness, high peel strength and oxidation resistance

The invention discloses a surface treatment method of a copper foil with low roughness, high peel strength and oxidation resistance. The surface treatment method specifically comprises the following steps: sequentially performing degreasing, acid pickling, primary curing, continuous two-time coarsening, secondary curing, blackening, anti-oxidation and silane treatment on the copper foil; a plating solution for roughening treatment comprises 160-260 g/L of sulfuric acid, 8-18 g/L of copper ions, 1-5 g/L of an organic additive and 0.5-2.0 g/L of an inorganic additive, the temperature of the plating solution is 13-26 DEG C, and the current density during electroplating is 45-70 A/dm. According to the surface treatment method disclosed by the invention, the copper foil still has relatively high peel strength while having relatively low roughness, the appearance color of the copper foil is uniform and good in consistency, the rough surface of the copper foil does not have a copper powder particle falling phenomeno