Bonding device and method for wave-absorbing material

The invention discloses a wave-absorbing material laminating device which comprises a laminating machine table part, an X-axis linear moving module, a feeding and discharging conveying assembly and a wave-absorbing material laminating assembly, the X-axis linear moving module drives a movable laminating cover part to move so that a laminating cavity can cover the wave-absorbing material, an air cylinder part is opened, and the wave-absorbing material can be laminated on the laminating cover part. A piston rod of an air cylinder part drives a lifting type conveying, attaching and pressing box to descend, at the moment, a lifting rod part drives a clamping saw blade part downwards, a sawtooth part of the clamping saw blade part is just clamped to one end of the wave-absorbing material, meanwhile, an auxiliary pressing strip is pressed downwards to the other end of the wave-absorbing material, and the X-axis linear moving module drives a movable attaching cover part to return and reset again; and the wave-absorb