Power electronic component

The invention relates to a power electronic component (100) and a method for producing a semi-finished product for a power electronic component (100). In order to specify an improved power electronic component (100), it is proposed that the component (100) has a substrate (20) which has a metallization (30) which forms a first and a second structure (35, 36) separated from one another by an intermediate space (40) and which has a thickness (D30) of at least 300 [mu] m, a power semiconductor (50) being applied to the first structure (35). An electrical insulator (42) having a thermal conductivity of at least 50 W/mK is arranged at least in sections relative to the intermediate spaces (40) in such a way that the structures (35, 36) adjoining the respective intermediate spaces (40) are thermally connected by means of the insulator (42). 本发明涉及一种功率电子组件(100)和一种用于生产用于功率电子组件(100)的半成品的方法。为了说明改进的功率电子组件(100)，提出，组件(100)具有基底(20)，该基底具有金属化部(30)，该金属化部通过中间空间(40)形成彼此分开的第一结构和第二结构(35，36)，并且该金属化部具有至少300μm的厚度(D30)，其中，在第一结构(35)上施加有