Method for reconstructing thickness profile of component to be detected

A method for reconstructing a thickness profile of a component to be detected, the method comprising, for a plurality of different emission points, the following steps: for a current emission point, emitting a plurality of ultrasonic pulses; generating a plurality of elementary echo signals associated with the respective ultrasonic pulses; selecting a pulse that produces a basic echo signal having the maximum amplitude; calculating the basic flight time of the selected pulse; calculating a coordinate of a surface contact point of the selected pulse; calculating a set of potential positions of the inner surface (3) of the component to be detected from the basic time of flight, the coordinates of the outer surface contact points and the propagation medium in the component to be detected, the method further comprising a step of calculating the contour of the inner surface (3) of the component to be detected by joining together separate portions of the set of potential positions. 一种用于重建待检测部件的厚度轮廓的方法，该方法对于多个不同的发射点