Embedded thermoelectric separation circuit board with ceramic substrate and power transistor
The invention relates to an embedded thermoelectric separation circuit board with a ceramic substrate and a power transistor, which mainly comprises a dielectric material layer, a heat dissipation ceramic block, a fixing part, a stepped metal electrode layer, the power transistor and a dielectric ma...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to an embedded thermoelectric separation circuit board with a ceramic substrate and a power transistor, which mainly comprises a dielectric material layer, a heat dissipation ceramic block, a fixing part, a stepped metal electrode layer, the power transistor and a dielectric material package, a through hole is formed in the dielectric material layer, the heat dissipation ceramic block is correspondingly embedded into the through hole, and the power transistor is embedded into the fixing part. The heat conductivity coefficient of the heat dissipation ceramic block is higher than that of the dielectric material layer, the heat dissipation ceramic block is thinner than the dielectric material layer, the stepped metal electrode layer conducts electricity and conducts heat of the power transistor, and after the dielectric material package is packaged, a source electrode pin, a collector electrode pin and a gate electrode pin of the stepped metal electrode layer are partially exposed. And the |
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