Micro electro mechanical chip

The invention discloses a micro-electro-mechanical chip which comprises a substrate, a supporting structure layer, a vibrating diaphragm layer and a back electrode layer. Cavities are formed in the middle parts of the substrate and the supporting structure layer; the vibrating diaphragm layer compri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SU ZHIYAN, QIU GUANXUN, LIN YUANSHAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a micro-electro-mechanical chip which comprises a substrate, a supporting structure layer, a vibrating diaphragm layer and a back electrode layer. Cavities are formed in the middle parts of the substrate and the supporting structure layer; the vibrating diaphragm layer comprises an inner diaphragm and a connecting handle connected with the inner diaphragm, the inner diaphragm and the back pole layer are both opposite to the cavity, airflow holes are formed between the outer sides of the inner diaphragm and the connecting handle and the supporting structure layer, and the top end of the connecting handle is connected with the supporting structure layer; limiting protrusions are arranged on the surfaces of the inner sides of the airflow holes. According to the application, the vibration shaking and displacement of the inner membrane are reduced by arranging the limiting structure, so that the risk of breakage of the connecting handle due to vibration shaking of the inner membrane is redu