High-temperature-resistant solid-state capacitor diaphragm and preparation method thereof
The invention relates to the technical field of paper for solid-state capacitors, and discloses a high-temperature-resistant solid-state capacitor diaphragm which is composed of aramid fibrid, aramid pulp and high-melting-point chopped fiber and has good high-temperature resistance. The aramid fibri...
Gespeichert in:
Hauptverfasser: | , , , , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to the technical field of paper for solid-state capacitors, and discloses a high-temperature-resistant solid-state capacitor diaphragm which is composed of aramid fibrid, aramid pulp and high-melting-point chopped fiber and has good high-temperature resistance. The aramid fibrid can combine the aramid pulp and the high-temperature-resistant fiber together, so that the diaphragm is endowed with good binding force and smaller pore diameter; in the preparation process, the diaphragm is subjected to hot pressing and plasma treatment, so that the ESR of the solid-state capacitor is effectively reduced.
本发明涉及固态电容器用纸技术领域,公开了一种耐高温固态电容器隔膜,所述电容器隔膜由芳纶沉析纤维、芳纶浆粕和高熔点短切纤维构成,具有良好的耐高温性;芳纶沉析纤维可以将芳纶浆粕、耐高温纤维结合在一起,赋予隔膜良好的结合力和较小的孔径;在制备过程中对隔膜进行热压和等离子体处理,有效降低固态电容器的ESR。 |
---|