Electroplating method of integrated co-fired inductor
The invention relates to the technical field of inductors, and provides an electroplating method of an integrated co-fired inductor, which comprises the following steps of: 1, manufacturing an inductor compact by preparing a prefabricated top blank, a prefabricated winding, a prefabricated bottom bl...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of inductors, and provides an electroplating method of an integrated co-fired inductor, which comprises the following steps of: 1, manufacturing an inductor compact by preparing a prefabricated top blank, a prefabricated winding, a prefabricated bottom blank and a prefabricated wire; 2, heating and pressure maintaining treatment is conducted on the inductance pressed blank through a hot press; 3, after cooling, bonding and forming, a circuit layer is formed on the surface of the inductance compact through laser marking of a laser marking machine; step 4, plating the inductance compact with a required electroplated layer through an electroplating process; and step 5, removing redundant electroplating materials on the electroplating layer of the inductor compact through a laser marking process of a laser marking machine. The electroplating method of the integrated co-fired inductor provided by the invention not only simplifies the preparation process, but also reduce |
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