Flip chip bonding point inspection method and electronic equipment

The invention provides a flip chip bonding point checking method and electronic equipment, and the method comprises the steps: obtaining a design layout GDS file of a flip chip, and the GDS file comprises bonding point information and interconnection hole information; extracting bonding point inform...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	CHEN RAOSUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
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