Flip chip bonding point inspection method and electronic equipment

The invention provides a flip chip bonding point checking method and electronic equipment, and the method comprises the steps: obtaining a design layout GDS file of a flip chip, and the GDS file comprises bonding point information and interconnection hole information; extracting bonding point information and interconnection hole information in the GDS file; checking the relation between the extracted bonding points and the interconnection holes according to a preset process design rule, and if the relation between the bonding points and the interconnection holes does not conform to the process design rule, marking the bonding points and the interconnection holes which do not conform to the process design rule; and adjusting the bonding points and the interconnection holes which do not conform to the process design rule based on the marks. Through the method, rapid inspection and adjustment can be carried out, and rapid tape-out of the flip chip is guaranteed. 本申请提供一种倒装芯片键合点检查方法及电子设备，包括：获取倒装芯片的设计版图GDS文件，所述GDS文