On-chip balun, chip and terminal

The invention provides an on-chip balun, a chip and a terminal. The on-chip balun comprises an insulating substrate, a primary inductor and a secondary inductor, wherein the primary inductor and the secondary inductor are stacked on the insulating substrate from bottom to top; the primary inductor a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHI YUJIE, MAO XIAOJIAN, GENG JUNFENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides an on-chip balun, a chip and a terminal. The on-chip balun comprises an insulating substrate, a primary inductor and a secondary inductor, wherein the primary inductor and the secondary inductor are stacked on the insulating substrate from bottom to top; the primary inductor and the secondary inductor are mutually insulated, and the main body shapes of the primary inductor and the secondary inductor are rounded rectangles. According to the invention, the manufacturing cost of the chip loaded with the on-chip balun can be reduced. 本发明提供一种片上巴伦、芯片和终端,其中片上巴伦包括:绝缘基体,以及在绝缘基体上自下而上堆叠的初级电感和次级电感;初级电感和次级电感相互绝缘,初级电感和次级电感的主体形状均为圆角矩形。本发明能够降低装载该片上巴伦的芯片的制作成本。