Heat dissipation device

The invention relates to the technical field of heat dissipation of communication equipment, and discloses a heat dissipation device which is used for meeting the heat dissipation requirement of the communication equipment. The heat dissipation device comprises a heat dissipation substrate, a gas tr...

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Bibliographische Detailangaben
1. Verfasser: YUAN SHUIGEN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of heat dissipation of communication equipment, and discloses a heat dissipation device which is used for meeting the heat dissipation requirement of the communication equipment. The heat dissipation device comprises a heat dissipation substrate, a gas transmission pipeline and a condensation assembly, a liquid refrigerant is stored in the heat dissipation substrate, the heat dissipation substrate comprises an evaporation end and a condensation end, and the evaporation end is used for being attached to the surface of a heating element; the two ends of the gas transmission pipeline communicate with the evaporation end and the condensation assembly correspondingly, and the gas transmission pipeline is used for transmitting a refrigerant which absorbs heat at the evaporation end and becomes gaseous to the condensation assembly; the condensation assembly communicates with the condensation end and is used for condensing a gaseous refrigerant into a liquid refrigerant an