Rapid metallization process for interlayer core layer blind hole of high-density interconnected printed circuit board

The invention discloses a rapid metallization process for a blind hole of an interlayer core layer of a high-density interconnected printed circuit board. The rapid metallization process comprises the following steps: 1) forming a blind hole through laser drilling; (2) an air pump is adopted for blowing and removing drilling waste, and cooling treatment is conducted on the periphery of the blind hole; (3) plasma cleaning equipment is adopted for deep impurity removal, the circuit board subjected to primary impurity removal sequentially passes through two plasma treatment tanks to be pretreated, and treatment liquid in the two plasma treatment tanks is a solution A and a solution B; (4) after plasma treatment, the circuit board is subjected to immersion cleaning in 300-350 mL/L sulfuric acid for 2 min, the temperature is controlled to be 50-55 DEG C, and then the circuit board is soaked in a mixed solution of sulfuric acid and chromic acid for 30-60 s; the treatment liquid is composed of palladium sulfate, a r