Electronic device and method of manufacturing same

An electronic device and a method of manufacturing the electronic device. In one example, an electronic device includes an electronic component including a component first side, a component second side opposite the component first side, and a component lateral side connecting the component first sid...

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Bibliographische Detailangaben
Hauptverfasser: KI WON MUN, BOWERS SHAUN, KIM HYO-HYUN, HWANG TAE-YOUNG, SCOTT GEORGE, MO YINSU
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:An electronic device and a method of manufacturing the electronic device. In one example, an electronic device includes an electronic component including a component first side, a component second side opposite the component first side, and a component lateral side connecting the component first side to the component second side, where the component lateral side defines a perimeter of the electronic component. A first intermediate terminal is coupled to the electronic component within the perimeter. An intermediate component is coupled to the first intermediate terminal within the perimeter. An encapsulant structure is over the intermediate component, at least a portion of the first intermediate terminal, and at least a portion of the electronic component. Other examples and related methods are also disclosed herein. 电子装置及制造电子装置的方法。在一个实例中,一种电子装置包含电子组件,所述电子组件包含组件第一侧、与所述组件第一侧相对的组件第二侧以及将所述组件第一侧连接到所述组件第二侧的组件横向侧,其中所述组件横向侧限定所述电子组件的周界。第一中间端子耦合到所述周界内的所述电子组件。中间组件耦合到所述周界内的所述第一中间端子。包封物结构在所述中间组件、所述第一中间端子的至少一部分和所述电子组件的至少一