Circuit board and semiconductor package having same

A circuit board according to an embodiment includes: an insulating layer having an upper surface and a lower surface; and a through electrode passing through an upper surface and a lower surface of the insulating layer, in which the through electrode includes: a first electrode portion disposed adjacent to the lower surface of the insulating layer and having a first inclination such that a width decreases toward the upper surface of the insulating layer; a second electrode portion disposed on the first electrode portion and having a second inclination such that a width increases toward an upper surface of the insulating layer; and a third electrode portion disposed between the first electrode portion and the second electrode portion and having a third inclination different from the first inclination and the second inclination; wherein the width of the part, closest to the third electrode part, of the first electrode part is smaller than or equal to the width of the third electrode part, and the width of the p