COPPER PARTICLE DISPERSION

The present invention pertains to a copper microparticle dispersion containing copper nanoparticles (A) dispersed with a polymer (B) containing a structural unit derived from a monomer (b-1) having a carboxyl group and a structural unit derived from a monomer (b-2) having a polyalkylene glycol segme...

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Bibliographische Detailangaben
Hauptverfasser:	EYAMA TAKAAKI, TAKIGUCHI OSAMU, YOSHIDA TOMOHIDE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASTING CHEMISTRY DYES MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES POWDER METALLURGY TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING METALLIC POWDER
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