COPPER PARTICLE DISPERSION

The present invention pertains to a copper microparticle dispersion containing copper nanoparticles (A) dispersed with a polymer (B) containing a structural unit derived from a monomer (b-1) having a carboxyl group and a structural unit derived from a monomer (b-2) having a polyalkylene glycol segment, and a dispersion medium (C), the polymer (B) containing a structural unit derived from a monomer (b-1) having a carboxyl group and a structural unit derived from a monomer (b-2) having a polyalkylene glycol segment. The content of a polyalkylene glycol segment in the polymer B is 55 mass% to 97 mass% inclusive, the acid value of the polymer B is 20 mgKOH/g to 250 mgKOH/g inclusive, and the dispersion medium C contains at least one substance selected from the group consisting of a (poly) alkylene glycol, a (poly) alkylene glycol derivative, a terpenol, glycerin and a glycerin derivative. The present invention also relates to a method for producing a bonded body, the method comprising a step for interposing the c