Multi-chip package

An electronic device may include a first die, which may include a first set of die contacts. The electronic device may include a second die, which may include a second set of die contacts. The electronic device may include a bridge interconnect, which may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnect material such as solder). The second set of bridge contacts may be coupled directly to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die. 电子设备可以包括第一管芯，该第一管芯可以包括第一组管芯触点。该电子设备可以包括第二管芯，该第二管芯可以包括第二组管芯触点。该电子设备可以包括桥式互连件，该桥式互连件可以包括第一组桥式触点并且可以包括第二组桥式触点。第一组桥式触点可以直接耦合到第一组管芯触点(例如，利用诸如焊料之类的互连材料)。第二组桥式触点可以直接耦合到第二组管芯触点(例如，利用焊料)。桥式互连件可以帮助便于第一管芯与第二管芯之间的电连通。