Process method for improving FPC stability and finished product storage method

The invention relates to the technical field of circuit board production, in particular to a process method for improving FPC stability and a finished product storage method. Aiming at the problem that the existing FPC process method is difficult to ensure the stability of the FPC, the adopted process method comprises the following steps of: performing character jet printing on a first FPC to obtain a second FPC; the method comprises the following steps: placing a second FPC in an FPC placing groove of a blister box, carrying out plasma treatment on the surface of the second FPC to obtain a third FPC, carrying out the plasma treatment to form a hydrophilic active group, placing the third FPC in the FPC placing groove of the blister box to obtain a first intermediate product, carrying out vacuum pumping on the first intermediate product to obtain a second intermediate product, and sealing the second intermediate product to obtain a finished product. According to the method, the dyne value of the surface of the