High-heat-dissipation PCB embedded with diamond copper and manufacturing process of high-heat-dissipation PCB

The invention discloses a high-heat-dissipation PCB embedded with diamond copper and a manufacturing process thereof, the PCB comprises a multilayer circuit board, a dielectric layer A is arranged between adjacent core boards of the multilayer circuit board, the multilayer circuit board is at least...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIE GUANGQIAN, WANG YUANJUN, SHA WEIQIANG, PARK CHAN-YOUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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