High-heat-dissipation PCB embedded with diamond copper and manufacturing process of high-heat-dissipation PCB

The invention discloses a high-heat-dissipation PCB embedded with diamond copper and a manufacturing process thereof, the PCB comprises a multilayer circuit board, a dielectric layer A is arranged between adjacent core boards of the multilayer circuit board, the multilayer circuit board is at least provided with a PTH hole penetrating through the multilayer core boards and the dielectric layer A, a diamond copper radiator is embedded in the multilayer circuit board, and the diamond copper radiator is embedded in the multilayer circuit board. A bonding layer is arranged between the side surface of the diamond copper radiator and the multilayer circuit board; according to the invention, the embedded diamond copper radiator is adopted in the PCB, so that the problem of high material cost caused by the metal-based design of the whole high-heat-dissipation PCB product is solved, and the problem that the high-density and multi-layer interconnection design cannot be realized by using the metal-based product is solve