Deformable electrostatic chuck and wafer adsorption method

The invention provides a deformable electrostatic chuck and a wafer adsorption method, and relates to the field of semiconductors. The chuck comprises an adsorption layer and a deformation layer which are stacked, fixedly connected and different in thermal expansion coefficient. The chuck further comprises a controller, a distance measuring element, a temperature measuring element and a temperature adjusting assembly. The distance measuring element is used for measuring the distance between the wafer and the adsorption layer. The temperature measuring element is used for measuring the temperature of the adsorption layer and the deformation layer; and the controller is used for determining the form and the deformation quantity of the wafer according to the distance measurement and temperature measurement results, and adjusting the temperature of the adsorption layer and the deformation layer through the temperature adjusting assembly so as to control the form and the deformation quantity of the adsorption laye