Chip test carrier plate with power assisting mechanism

The method is suitable for the technical field of chip packaging testing. The invention discloses a chip test carrier plate with a power assisting mechanism, which comprises a carrier plate body and a pull assisting device rotationally connected with the carrier plate body, the carrier plate body is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIU YUNFENG, ZHANG BO, DU HAIQUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The method is suitable for the technical field of chip packaging testing. The invention discloses a chip test carrier plate with a power assisting mechanism, which comprises a carrier plate body and a pull assisting device rotationally connected with the carrier plate body, the carrier plate body is provided with a storage cavity for storing and fixing a test plate, and a plurality of clearance structures and pins for positioning the test plate are arranged in the storage cavity. The supporting strips are arranged between the adjacent receding structures so that gaps can be formed between the test board and the bottom of the containing cavity, the test board is located in the containing cavity in the testing process, and the chip bearing seats on the test board are located above the receding structures. When the support plate is used, a test plate is screwed in the accommodating cavity, is positioned through pins and then is fixed through screws, then an upper separation blade and a lower separation blade are