Device for detecting temperature difference and determination method
The micromechanical sensor device consists of at least one first and one second semiconductor structure element which are connected to each other in such a way that the second semiconductor structure element is arranged on the first semiconductor structure element. According to the invention, at lea...
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| creator | DANNENBERG ARNE |
| description | The micromechanical sensor device consists of at least one first and one second semiconductor structure element which are connected to each other in such a way that the second semiconductor structure element is arranged on the first semiconductor structure element. According to the invention, at least one of the semiconductor structural elements has an evaluation circuit for detecting and/or determining a thermoelectric voltage or temperature difference. The evaluation circuit can also be provided for actuating and/or evaluating the sensor device on one of the two semiconductor components. The two semiconductor structure elements are connected with at least one pair of bonding wires. A bonding wire pair consisting of the first and second bonding wires can be used to electrically connect the two semiconductor structural elements and/or to supply a circuit and/or a sensor device on one of the semiconductor structural elements. The core of the invention is that the two bonding wires of at least one bonding wire |
| format | Patent |
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According to the invention, at least one of the semiconductor structural elements has an evaluation circuit for detecting and/or determining a thermoelectric voltage or temperature difference. The evaluation circuit can also be provided for actuating and/or evaluating the sensor device on one of the two semiconductor components. The two semiconductor structure elements are connected with at least one pair of bonding wires. A bonding wire pair consisting of the first and second bonding wires can be used to electrically connect the two semiconductor structural elements and/or to supply a circuit and/or a sensor device on one of the semiconductor structural elements. 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According to the invention, at least one of the semiconductor structural elements has an evaluation circuit for detecting and/or determining a thermoelectric voltage or temperature difference. The evaluation circuit can also be provided for actuating and/or evaluating the sensor device on one of the two semiconductor components. The two semiconductor structure elements are connected with at least one pair of bonding wires. A bonding wire pair consisting of the first and second bonding wires can be used to electrically connect the two semiconductor structural elements and/or to supply a circuit and/or a sensor device on one of the semiconductor structural elements. The core of the invention is that the two bonding wires of at least one bonding wire</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR TRANSPORTING |
| title | Device for detecting temperature difference and determination method |
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