Device for detecting temperature difference and determination method

The micromechanical sensor device consists of at least one first and one second semiconductor structure element which are connected to each other in such a way that the second semiconductor structure element is arranged on the first semiconductor structure element. According to the invention, at least one of the semiconductor structural elements has an evaluation circuit for detecting and/or determining a thermoelectric voltage or temperature difference. The evaluation circuit can also be provided for actuating and/or evaluating the sensor device on one of the two semiconductor components. The two semiconductor structure elements are connected with at least one pair of bonding wires. A bonding wire pair consisting of the first and second bonding wires can be used to electrically connect the two semiconductor structural elements and/or to supply a circuit and/or a sensor device on one of the semiconductor structural elements. The core of the invention is that the two bonding wires of at least one bonding wire