Automatic packaging machine for solder wires

The invention belongs to the field of solder wires, particularly relates to an automatic packaging machine for solder wires, and aims to solve the problems that when an existing coiled solder wire is packaged, due to the fact that a package needs to be arranged on the solder wire in a sleeving mode,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIANG FANG, ZHAO TUQIANG, HUANG LUJIANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention belongs to the field of solder wires, particularly relates to an automatic packaging machine for solder wires, and aims to solve the problems that when an existing coiled solder wire is packaged, due to the fact that a package needs to be arranged on the solder wire in a sleeving mode, and long-strip-shaped packaging paper is adopted and surrounds the solder wire and the cut-off position to be pasted, operation is tedious, and the package is prone to deviating; in order to solve the problems of low efficiency and the like in the prior art, the invention provides the following scheme that the tin wire device comprises four second fixing columns, a packaging bag and a plurality of tin wire bodies, the four second fixing columns are symmetrically fixed on the ground in pairs, and a same second connecting plate is fixedly connected between the two second fixing columns located on the same side. The four friction wheels rotate at the same time, the packaging bag can be driven to move downwards, the m