PC plate film pasting technology

The invention relates to a PC plate film pasting technology, and relates to the technical field of film pasting technologies, the PC plate film pasting technology comprises the following film pasting steps: pretreatment: removing a protective film of a PC plate, and carrying out plasma cleaning on the PC plate for standby application; processing: printing the PC board to form a plurality of groups of to-be-carved models; all the to-be-carved models on the PC board are carved, and then the carved models are cut off from the PC board for standby application; and film pasting: pasting an OCA film on the cut models, and then pasting the OCA film on all the cut models through back glue. The OCA film has the advantages that the adhesive strength of the OCA film on the PC board is improved, and the bubbling phenomenon of the OCA film on the PC board is effectively reduced. 本申请涉及PC板材贴膜工艺，涉及贴膜工艺技术领域，PC板材贴膜工艺包括如下贴膜步骤：预处理：去除PC板材的防护膜，对PC板材进行等离子清洗，以备用；加工：对PC板材印刷，形成多组待雕刻模型；对PC板材上的所有待雕刻模型进行雕刻，再将雕刻的模型从PC板材上切割下来，以备用；贴膜：将OCA膜贴