Integrated circuit device

There is provided an integrated circuit device including: a substrate including a first active region and a second active region each extending in a first direction; a bit line extending in a first direction in the first trench of the substrate and arranged between the first active region and the second active region in a second direction perpendicular to the first direction; a contact structure including a lower contact contacting the bit line and an upper contact contacting the first active region; a word line extending in a second direction in a second trench of the substrate; a plurality of bond pads on the substrate; and a capacitor structure including a plurality of lower electrodes on the plurality of bond pads, in which the bit line and the word line are buried below the upper surface of the substrate. 提供了一种集成电路装置，所述集成电路装置包括：基底，包括各自沿第一方向延伸的第一有源区域和第二有源区域；位线，在基底的第一沟槽中沿第一方向延伸，并且在垂直于第一方向的第二方向上布置在第一有源区域与第二有源区域之间；接触结构，包括接触位线的下接触件和接触第一有源区域的上接触件；字线，在基底的第二沟槽中沿第二方向延伸；多个接合垫，在基底上；以及电容器结构，包括在多个接合垫上的多个下电极，其中，位线和字线掩