Compression structure for IC package

The invention relates to a compressed structure for IC package. More specifically, the present invention provides structures, methods, and apparatus for protecting interconnects between components and boards in an electronic device from damage caused by physical impacts. This damage may occur due to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NEGI VISHAL, MARKADT, STEVEN, J, KALTENBEIL CHRISTOPH, XIA ZHIYONG C, CAMPBELL, STEPHEN, JOHN, GANASIAN STEPHEN V, RAMANI HITESH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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