Compression structure for IC package

The invention relates to a compressed structure for IC package. More specifically, the present invention provides structures, methods, and apparatus for protecting interconnects between components and boards in an electronic device from damage caused by physical impacts. This damage may occur due to differential tension applied between the component and the plate during a drop or other impact event. One example may reduce or prevent damage by providing a differential compression force between the component and the plate, which may counteract differential tension between the component and the plate during the impact event. Another example may reduce or prevent damage by reducing differential tension between the component and the plate. Another example may secure a component to the plate to directly reduce differential power in order to prevent damage. 本公开涉及用于IC封装的压缩结构。更具体而言，本发明提供了用于保护电子设备中的部件和板之间的互连件免受由物理冲击导致的损坏的结构、方法和装置。这种损坏可能由于在掉落或其他冲击事件期间在该部件和该板之间施加的差动张力而发生。一个示例可以通过在该部件和该板之间提供差动压缩力来减少或防止损坏，该差动压缩力可以抵消在该冲击事件期