Automatic wire binding mechanism and wire binding method for substrate part pins before plating

The invention belongs to the technical field of base plate part pin electroplating, and particularly relates to a base plate part pin pre-plating automatic wire binding mechanism which comprises a part, a wire binding assembly, a clamping assembly and a wire cutting assembly, the part comprises a base plate and a pin arranged on the base plate, the wire binding assembly comprises a transverse moving module, a bottom plate is arranged at the output end of the transverse moving module, and the clamping assembly is arranged on the bottom plate. The bottom plate is provided with an anti-jumper roller, a wire clamping jaw, a guide rod, a longitudinal module and a wire pulling clamping jaw, the output end of the longitudinal module is provided with a vertical module, and the vertical module is provided with a guide pin; the invention provides an automatic mechanism for binding wires before plating of pins of substrate parts, and mainly aims to solve the problem of binding the wires of the pins of the substrate part