Three-dimensional integrated circuit, integrated circuit and first-aid method thereof

The invention discloses a three-dimensional integrated circuit, an integrated circuit and a first-aid method thereof, a logic chip and a storage chip are stacked and packaged in a 3DIC bonding mode, first-aid units are reserved in the logic chip and the storage chip respectively, and when the design of the logic chip and the storage chip goes wrong in a test, the first-aid units can be used as first-aid units. The first-aid units reserved in the logic chip and the storage chip in advance can be bonded again in a 3DIC bonding mode, so that optimization and revision of the chips are realized, the production cost is greatly saved, and the production period is shortened. 本发明公开了一种三维集成电路、集成电路及其急救方法，逻辑芯片与存储芯片通过3DIC的键合方式进行层叠封装，并在逻辑芯片与存储芯片中分别预留有急救单元，当逻辑芯片和存储芯片的设计在测试中出现问题，通过逻辑芯片和存储芯片中提前预留的急救单元就可通过3DIC的键合方式进行重新邦定，从而实现芯片的优化和改版，大大节省了生产成本并缩短了生产周期。