Package substrate

A packaging substrate comprises a core board body, a first circuit structure and a second circuit structure, the first circuit structure and the second circuit structure are arranged on the two opposite sides of the core board body, so that the number of wiring layers of the second circuit structure is different from the number of wiring layers of the first circuit structure, and the packaging substrate is asymmetrical. And designing the first circuit structure and the second circuit structure according to the thicknesses and CTE of the first dielectric layer of the first circuit structure and the second dielectric layer of the second circuit structure, so as to avoid the warping problem of the packaging substrate. 一种封装基板，包括一核心板体及设于该核心板体相对两侧的第一线路结构及第二线路结构，以令该第二线路结构的布线层数与该第一线路结构的布线层数不相同，使该封装基板呈非对称式，并依据该第一线路结构的第一介电层与该第二线路结构的第二介电层的厚度及CTE设计该第一线路结构与第二线路结构，以避免该封装基板发生翘曲的问题。