Package substrate and manufacturing method thereof

The invention provides a package substrate and a manufacturing method thereof. According to the packaging substrate, a circuit block body is arranged on a substrate body through a bonding layer, the circuit block body is wrapped by a wrapping layer, a circuit part is formed on the wrapping layer, an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN SONGKUN, ZHANG CHUIHONG, CHEN MINYAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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