Package substrate and manufacturing method thereof

The invention provides a package substrate and a manufacturing method thereof. According to the packaging substrate, a circuit block body is arranged on a substrate body through a bonding layer, the circuit block body is wrapped by a wrapping layer, a circuit part is formed on the wrapping layer, and a conductive column body is formed in the wrapping layer, so that the circuit block body can be embedded in the wrapping layer without making a groove. Therefore, the packaging substrate provided by the invention can shorten the process time. 本发明提出一种封装基板及其制法。封装基板包括于一基板本体上通过结合层设置一线路块体，再以包覆层包覆该线路块体，之后于该包覆层上形成线路部，且于该包覆层中形成导电柱体，因而无需制作凹槽，即可将该线路块体埋设于该包覆层中，故本发明的封装基板能缩减工艺时间。