SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The present invention provides a technique capable of improving accuracy in pickup while suppressing an increase in pickup time. The semiconductor manufacturing apparatus includes: a stage that holds a bare chip; the head part is provided with a collet chuck which is provided with a suction hole for sucking the bare chip; a flow sensor provided in a pipe communicating with the suction hole; and the control device is used for acquiring related data before production. The control device is configured such that the lower end surface of the collet is lowered to a position at a predetermined height from the upper surface of the bare chip held by the table, and at the predetermined height, the flow rate of the gas flowing through the suction hole of the collet is detected by the flow rate sensor, and the flow rate of the gas flowing through the suction hole of the collet is detected by the flow rate sensor. On the basis of the correlation data and the flow detected at the predetermined height, the lowering amount f