Method of fabricating electronic package and carrier structure thereof

The invention provides a manufacturing method of an electronic package and a bearing structure thereof. The bearing structure comprises a bearing plate and a circuit layer, the bearing plate comprises a plate body, a first metal layer, a second metal layer and a third metal layer, the first metal layer, the second metal layer and the third metal layer are sequentially combined on the plate body, and the circuit layer is combined on the third metal layer, so that the bearing structure does not need to use a solder mask layer, and related processes for manufacturing the solder mask layer are not needed. And the manufacturing cost is effectively reduced. 本发明提出一种电子封装件的制法及其承载结构。承载结构包括承载板以及线路层，该承载板包含板体、依序结合于该板体上的第一金属层、第二金属层及第三金属层，以令该线路层结合于该第三金属层上，故该承载结构无需使用防焊层，因而无需进行制作防焊层的相关工艺，以有效降低制作成本。