METHOD OF FORMING PROTECTIVE FILM ON ELECTRONIC MODULE

The invention provides a method for forming a protective film on an electronic module. The method comprises the following steps: placing the electronic module and a protective material arranged on the electronic module in a cavity; a first heating program is conducted on the protection material in t...

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Bibliographische Detailangaben
1. Verfasser:	LIU SHAOQI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention provides a method for forming a protective film on an electronic module. The method comprises the following steps: placing the electronic module and a protective material arranged on the electronic module in a cavity; a first heating program is conducted on the protection material in the cavity, a first boosting program is conducted on the cavity, and the pressure of the first boosting program is larger than 1 atmospheric pressure; after softening the protective material, maintaining the first heating procedure, and performing a depressurization oscillation procedure on the cavity, the depressurization oscillation procedure comprising alternately changing the pressure of the cavity among a plurality of low pressures lower than 1 atmospheric pressure; maintaining the first heating program, and performing a second boosting program on the cavity, the pressure of the second boosting program being less than that of the first boosting program and greater than 1 atmospheric pressure; and performing a s